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  • CISIS 2009
    ...chnological implications in areas including robotics, actuator technology, materials,
    13 KB (1,706 words) - 16:34, 27 December 2015
  • IDC 2009
    ...ess embedded technologies, robots, accessible fabrication devices, "smart" materials, authoring/programming tools)
    5 KB (631 words) - 05:50, 14 October 2008
  • IWJT 2009
    * Silicide and Contact Technology for CMOS --- Silicide materials and salicide technology, elevated S/D, low barrier contact, surface pre-tre * Equipment, Materials and Substrates for Junction Technologies
    2 KB (281 words) - 17:32, 14 October 2008
  • ICCES 2009
    CMC: Computers, Materials, & Continua CMC: Materials by Design
    5 KB (658 words) - 17:47, 14 October 2008
  • ISTC/CSTIC 2009
    ...the-Line (FEOL), Back-End-of-the-Line (BEOL), packaging as well as silicon materials. Symposium III: New Materials and Process Integration
    3 KB (403 words) - 20:05, 14 October 2008
  • WMED 2009
    ..., and novel assembly processes. Novel packaging structures, processes, and materials. - Novel processes and materials, MEMS research, development and performance.
    3 KB (417 words) - 20:06, 14 October 2008
  • AILA 2008
    ...eacher Education (e.g. Methodology, Syllabus Design, Learning and Teaching Materials)
    3 KB (389 words) - 23:00, 14 October 2008
  • CASLA 2008
    - From the internet corpus to usable learning materials;
    9 KB (1,256 words) - 10:56, 20 November 2020
  • PsychoCompLA 2008
    other supplementary materials. Abstracts should be anonymous, clearly titled
    8 KB (1,014 words) - 23:06, 14 October 2008
  • DESI 2008
    - New types of materials, including informal language (e.g., in
    4 KB (610 words) - 14:22, 27 November 2020
  • BEA 2008
    * Automated processing of spoken and written lecture materials across * Semantic-based access to instructional materials
    6 KB (825 words) - 17:06, 27 December 2015
  • SigDial 2008
    Authors are encouraged to make illustrative materials available, on the web or otherwise. For example, excerpts of recorded conve
    5 KB (646 words) - 14:36, 15 June 2020
  • IMMERSCOM 2009
    1) title and outline of materials to be presented,
    6 KB (823 words) - 23:11, 14 October 2008
  • DESS 2008
    Materials & Processing;
    2 KB (281 words) - 00:33, 15 October 2008
  • IEEE ICCSC 2008
    - New materials, chips,and circuit designs for high-capacity, multimedia communication
    3 KB (414 words) - 23:13, 14 October 2008
  • CIAWES 2008
    ...es and their individual preferences about how they like to learn, learning materials and courses can be adapted and more accurate intelligent support can be pro
    6 KB (839 words) - 23:13, 14 October 2008
  • BOBCATSSS 2009
    ...tten. They also challenge the old ways of thinking and working. Changes in materials, the rapid increase in the use of web environments, as well as the ever inc
    3 KB (490 words) - 10:33, 7 June 2020
  • SIRTEL 2008
    - Game-theoretic approaches to select learning materials and learning partners in the long tail
    7 KB (989 words) - 23:13, 14 October 2008
  • ISPRA 2009
    Robotics materials
    8 KB (982 words) - 23:17, 14 October 2008
  • MPSVA 2009
    ...The aim of the conference is to bring together physicists, mathematicians, materials scientists and engineers from academia and industry, and to provide a platf * Composite materials
    3 KB (403 words) - 23:17, 14 October 2008
  • M3 2011
    |Title=Annual International Conference on Materials Science, Metal and Manufacturing Annual International Conference on Materials Science, Metal and Manufacturing (M3 2011)
    4 KB (424 words) - 10:39, 24 June 2011
  • NSPW 2008
    ...the topic will lead to a lively discussion, and other optional supporting materials such as the credentials of the proposed panelists.
    8 KB (1,072 words) - 23:20, 14 October 2008
  • META 2008
    ...ction of a diverse spectrum of electrical, microwave, infrared and optical materials and devices. ...nents. Special attention will be given to applications of these innovative materials in secure wireless and optical communication systems, antennas, high-speed
    2 KB (276 words) - 23:20, 14 October 2008
  • DSS 2008
    ...engineers from industry, military, and academia doing cutting-edge work in materials, technology, systems and devices.
    1 KB (167 words) - 23:20, 14 October 2008
  • SysML 2008
    Registration Materials
    6 KB (837 words) - 23:21, 14 October 2008
  • ULIS 2009
    ...electronics: strained Si, strained SOI, SiGe, GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devi * Thin gate dielectrics: first and second generation high-k materials for switches and memory.
    4 KB (507 words) - 23:21, 14 October 2008
  • IWCE 2009
    nano-materials, optoelectronic and organic devices and sensors are also included. The lation �?� Simulation of materials and material interfaces.
    3 KB (385 words) - 23:21, 14 October 2008
  • ASMC 2009
    * Advanced Processes and Materials Walter Schoenleber, Applied Materials
    4 KB (554 words) - 23:21, 14 October 2008
  • IWDTF 2008
    ...gate stacks, which include metal gate electrodes and high-mobility channel materials, will also be discussed. The IWDTF will provide a great opportunity for inf
    4 KB (642 words) - 23:21, 14 October 2008
  • SISC 2008
    ...ce that provides a forum for device engineers, solid state physicists, and materials scientists to discuss topics of common interest both formally through invit ...SC is sponsored by the IEEE Electron Device Society and is endorsed by the Materials Research Society.
    3 KB (473 words) - 23:21, 14 October 2008
  • MNC 2008
    1-3:Resist Materials and Processing
    1 KB (144 words) - 23:21, 14 October 2008
  • IVESC 2008
    | Homepage = www.materials.qmul.ac.uk/conferences/ivesc2008/submit
    566 bytes (63 words) - 23:21, 14 October 2008
  • ISDN 2008
    | Title = International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability, and Manufacturing
    633 bytes (68 words) - 23:22, 14 October 2008
  • IITC 2008
    ...um for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exc Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference on June 4 and 5. Supplier seminars will
    6 KB (798 words) - 23:22, 14 October 2008
  • C3IT 2009
    9. Photonic Devices 29. Physics, Materials & CAD
    3 KB (357 words) - 23:23, 14 October 2008
  • BTW 2008
    ...the accepted contributions whose authors wish to provide the corresponding materials on the BTW web site.
    3 KB (407 words) - 23:23, 14 October 2008
  • MNRC 2008
    * Nanoelectronics Materials and Devices
    2 KB (228 words) - 23:24, 14 October 2008
  • IPTA 2008
    ...rocessing theory and tools, for attending extensive educational high level materials, sharing their achievements, exchanging their experiences and discussing fu
    4 KB (475 words) - 23:25, 14 October 2008
  • SoCG 2008
    ...en pages) may be included directly in the submitted file; other supporting materials (such as video or multimedia presentation, source code, experimental data.. Appendices and supporting materials will not be regarded as part of the actual submission and will be considere
    5 KB (727 words) - 23:27, 14 October 2008
  • NIF 2008
    Leveraging Nanotech-Enabled Applications and Advanced Materials for Business and Investment Opportunities ...financing the global economy's nanotech-enabled applications and advanced materials.
    4 KB (456 words) - 23:28, 14 October 2008
  • ICMA 2009
    - opto-electronic elements and Materials, laser technology and laser processing
    3 KB (482 words) - 23:29, 14 October 2008
  • MEMS 2009
    * Silicon and non-silicon materials
    2 KB (278 words) - 22:54, 4 February 2009
  • CANEUS 2008
    * Exciting early research results in MNT materials, devices, and systems. Structures and Materials
    8 KB (999 words) - 23:30, 14 October 2008
  • NMDC 2008
    | Title = 2nd Nanotechnology Materials and Devices Conference
    525 bytes (57 words) - 23:30, 14 October 2008
  • NT 2008
    Nanotubes belong to a class of materials which owing to their quasi one-dimensional structure exhibit a variety of f * Mechanical properties of nanotubes and composite materials
    2 KB (290 words) - 23:30, 14 October 2008
  • ANM 2008
    | Title = 2nd International Conference on Advanced Nano Materials The aim of the 2nd International Conference on Advanced Nano Materials (ANM 2008) is to bring together eminent researchers from both academia and
    2 KB (209 words) - 17:00, 27 December 2015
  • NANA 2008
    ...ameliorating the cost, durability, and weight of extant aircraft building materials. No less important, nanotechnology could one day solve the world's energy p
    4 KB (548 words) - 23:30, 14 October 2008
  • NANO - RIO 2008
    | Title = 9th International Conference on Nanostructured Materials
    558 bytes (64 words) - 23:30, 14 October 2008
  • SmartMat 2008
    | Title = Smart/Intelligent Materials and Nano Technology ...industrialists interested in the recent developments in smart/intelligent materials.
    4 KB (448 words) - 23:30, 14 October 2008
  • NanoSPD 2008
    ...in basic aspects and applications of ultrafine grained and nanostructured materials. ..., 2008. All papers presented at NanoSPD4 will appear in a special issue of Materials Science Forum, published by Trans Tech Publications in Switzerland (http://
    3 KB (381 words) - 23:30, 14 October 2008

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