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  • M3 2011
    |Title=Annual International Conference on Materials Science, Metal and Manufacturing Annual International Conference on Materials Science, Metal and Manufacturing (M3 2011)
    4 KB (424 words) - 10:39, 24 June 2011
  • NSPW 2008
    ...the topic will lead to a lively discussion, and other optional supporting materials such as the credentials of the proposed panelists.
    8 KB (1,072 words) - 23:20, 14 October 2008
  • META 2008
    ...ction of a diverse spectrum of electrical, microwave, infrared and optical materials and devices. ...nents. Special attention will be given to applications of these innovative materials in secure wireless and optical communication systems, antennas, high-speed
    2 KB (276 words) - 23:20, 14 October 2008
  • DSS 2008
    ...engineers from industry, military, and academia doing cutting-edge work in materials, technology, systems and devices.
    1 KB (167 words) - 23:20, 14 October 2008
  • SysML 2008
    Registration Materials
    6 KB (837 words) - 23:21, 14 October 2008
  • ULIS 2009
    ...electronics: strained Si, strained SOI, SiGe, GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devi * Thin gate dielectrics: first and second generation high-k materials for switches and memory.
    4 KB (507 words) - 23:21, 14 October 2008
  • IWCE 2009
    nano-materials, optoelectronic and organic devices and sensors are also included. The lation �?� Simulation of materials and material interfaces.
    3 KB (385 words) - 23:21, 14 October 2008
  • ASMC 2009
    * Advanced Processes and Materials Walter Schoenleber, Applied Materials
    4 KB (554 words) - 23:21, 14 October 2008
  • IWDTF 2008
    ...gate stacks, which include metal gate electrodes and high-mobility channel materials, will also be discussed. The IWDTF will provide a great opportunity for inf
    4 KB (642 words) - 23:21, 14 October 2008
  • SISC 2008
    ...ce that provides a forum for device engineers, solid state physicists, and materials scientists to discuss topics of common interest both formally through invit ...SC is sponsored by the IEEE Electron Device Society and is endorsed by the Materials Research Society.
    3 KB (473 words) - 23:21, 14 October 2008
  • MNC 2008
    1-3:Resist Materials and Processing
    1 KB (144 words) - 23:21, 14 October 2008
  • IVESC 2008
    | Homepage = www.materials.qmul.ac.uk/conferences/ivesc2008/submit
    566 bytes (63 words) - 23:21, 14 October 2008
  • ISDN 2008
    | Title = International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability, and Manufacturing
    633 bytes (68 words) - 23:22, 14 October 2008
  • IITC 2008
    ...um for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exc Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference on June 4 and 5. Supplier seminars will
    6 KB (798 words) - 23:22, 14 October 2008
  • C3IT 2009
    9. Photonic Devices 29. Physics, Materials & CAD
    3 KB (357 words) - 23:23, 14 October 2008
  • BTW 2008
    ...the accepted contributions whose authors wish to provide the corresponding materials on the BTW web site.
    3 KB (407 words) - 23:23, 14 October 2008
  • MNRC 2008
    * Nanoelectronics Materials and Devices
    2 KB (228 words) - 23:24, 14 October 2008
  • IPTA 2008
    ...rocessing theory and tools, for attending extensive educational high level materials, sharing their achievements, exchanging their experiences and discussing fu
    4 KB (475 words) - 23:25, 14 October 2008
  • SoCG 2008
    ...en pages) may be included directly in the submitted file; other supporting materials (such as video or multimedia presentation, source code, experimental data.. Appendices and supporting materials will not be regarded as part of the actual submission and will be considere
    5 KB (727 words) - 23:27, 14 October 2008
  • NIF 2008
    Leveraging Nanotech-Enabled Applications and Advanced Materials for Business and Investment Opportunities ...financing the global economy's nanotech-enabled applications and advanced materials.
    4 KB (456 words) - 23:28, 14 October 2008
  • ICMA 2009
    - opto-electronic elements and Materials, laser technology and laser processing
    3 KB (482 words) - 23:29, 14 October 2008
  • MEMS 2009
    * Silicon and non-silicon materials
    2 KB (278 words) - 22:54, 4 February 2009
  • CANEUS 2008
    * Exciting early research results in MNT materials, devices, and systems. Structures and Materials
    8 KB (999 words) - 23:30, 14 October 2008
  • NMDC 2008
    | Title = 2nd Nanotechnology Materials and Devices Conference
    525 bytes (57 words) - 23:30, 14 October 2008
  • NT 2008
    Nanotubes belong to a class of materials which owing to their quasi one-dimensional structure exhibit a variety of f * Mechanical properties of nanotubes and composite materials
    2 KB (290 words) - 23:30, 14 October 2008
  • ANM 2008
    | Title = 2nd International Conference on Advanced Nano Materials The aim of the 2nd International Conference on Advanced Nano Materials (ANM 2008) is to bring together eminent researchers from both academia and
    2 KB (209 words) - 17:00, 27 December 2015
  • NANA 2008
    ...ameliorating the cost, durability, and weight of extant aircraft building materials. No less important, nanotechnology could one day solve the world's energy p
    4 KB (548 words) - 23:30, 14 October 2008
  • NANO - RIO 2008
    | Title = 9th International Conference on Nanostructured Materials
    558 bytes (64 words) - 23:30, 14 October 2008
  • SmartMat 2008
    | Title = Smart/Intelligent Materials and Nano Technology ...industrialists interested in the recent developments in smart/intelligent materials.
    4 KB (448 words) - 23:30, 14 October 2008
  • NanoSPD 2008
    ...in basic aspects and applications of ultrafine grained and nanostructured materials. ..., 2008. All papers presented at NanoSPD4 will appear in a special issue of Materials Science Forum, published by Trans Tech Publications in Switzerland (http://
    3 KB (381 words) - 23:30, 14 October 2008
  • Solar 2008
    ...esting Systems, Supramolecular Nanomaterials and Lithography, Polymers and Materials, etc. Physical properties of thin films of molecular organic materials
    6 KB (742 words) - 23:30, 14 October 2008
  • MPA 2008
    | Title = 2nd International Meeting on Developments in Materials, Processes and Applications of Nanotechnology
    681 bytes (78 words) - 23:30, 14 October 2008
  • Nano Energy 2008
    Today, nano-materials are the foundation for a fast-growing approach to energy saving. Indeed, na ...t of automobiles by the use of carbon nanotube and nanofibers in composite materials for weight reduction in automotive applications.
    3 KB (367 words) - 06:10, 12 April 2010
  • CIMTEC 2008
    | Title = The 3rd International Conference on Smart Materials, Structures and Systems The 3rd International Conference "Smart Materials, Structures and Systems" will be held in Acireale (Catania District), Sicil
    2 KB (339 words) - 23:30, 14 October 2008
  • APBC 2009
    Authors can provide supplementary materials at their own website
    10 KB (1,209 words) - 17:05, 27 December 2015
  • ICC 2020
    Centers for Disease Control’s reference materials
    3 KB (442 words) - 09:29, 4 August 2023
  • WALMI 2008
    | Title = SEMINAR ON APPLICATION OF LASER IN MATERIALS PROCESSING
    500 bytes (56 words) - 23:34, 14 October 2008
  • SCMC 2008
    | Title = Solid State and Materials Chemistry
    509 bytes (57 words) - 23:35, 14 October 2008
  • MobiSec 2009
    1) title and outline of materials to be presented,
    4 KB (451 words) - 23:37, 14 October 2008
  • TERA 2008
    * Novel materials for THz applications
    2 KB (270 words) - 23:37, 14 October 2008
  • MWP 2008
    * Advances in materials for analog fiber links
    2 KB (237 words) - 23:38, 14 October 2008
  • FEM 2008
    * FEM Applications: Antennas, Materials and Meta-materials, Bio-electromagnetics, Electromagnetic Compatibility, Circuits and Circuit
    2 KB (190 words) - 23:39, 14 October 2008
  • OSDI 2008
    Registration Materials
    8 KB (1,171 words) - 13:44, 16 November 2016
  • Structural Dynamics & Mat. 2009
    | Title = 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference (SDM) 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
    4 KB (540 words) - 23:39, 14 October 2008
  • RadarConf 2009
    ...of-the-art signal processing components, materials (including chiral, meta-materials, and others), manufacturing techniques and packaging, distributed processin
    5 KB (625 words) - 20:19, 23 June 2020
  • MEFL 2008
    ...e cover the participation in the conference, a hard copy of the Conference materials (collection of the conference reports and thesis, some additional info pack
    5 KB (668 words) - 11:41, 29 September 2016
  • SE@M 2008
    | Title = Second International Workshop on Search and Exchange of e-le@rning Materials Second International Workshop on Search and Exchange of e-le@rning Materials (SE@M'08)
    6 KB (821 words) - 23:41, 14 October 2008
  • ISAPE 2008
    E2. Absorbing Materials F14. New Materials
    4 KB (564 words) - 23:41, 14 October 2008
  • ECTC 2009
    substrates;electronic components-design,materials,processing,test,characterization; nano materials and processes;tunable materials,structures,devices and switches;
    7 KB (1,023 words) - 23:41, 14 October 2008
  • SSMC 2008
    | Title = Solid State and Materials Chemistry
    507 bytes (57 words) - 23:42, 14 October 2008

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