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• M3 2011
  |Title=Annual International Conference on Materials Science, Metal and Manufacturing Annual International Conference on Materials Science, Metal and Manufacturing (M3 2011)
  4 KB (424 words) - 10:39, 24 June 2011
• NSPW 2008
  ...the topic will lead to a lively discussion, and other optional supporting materials such as the credentials of the proposed panelists.
  8 KB (1,072 words) - 23:20, 14 October 2008
• META 2008
  ...ction of a diverse spectrum of electrical, microwave, infrared and optical materials and devices. ...nents. Special attention will be given to applications of these innovative materials in secure wireless and optical communication systems, antennas, high-speed
  2 KB (276 words) - 23:20, 14 October 2008
• DSS 2008
  ...engineers from industry, military, and academia doing cutting-edge work in materials, technology, systems and devices.
  1 KB (167 words) - 23:20, 14 October 2008
• SysML 2008
  Registration Materials
  6 KB (837 words) - 23:21, 14 October 2008
• ULIS 2009
  ...electronics: strained Si, strained SOI, SiGe, GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devi * Thin gate dielectrics: first and second generation high-k materials for switches and memory.
  4 KB (507 words) - 23:21, 14 October 2008
• IWCE 2009
  nano-materials, optoelectronic and organic devices and sensors are also included. The lation �?� Simulation of materials and material interfaces.
  3 KB (385 words) - 23:21, 14 October 2008
• ASMC 2009
  * Advanced Processes and Materials Walter Schoenleber, Applied Materials
  4 KB (554 words) - 23:21, 14 October 2008
• IWDTF 2008
  ...gate stacks, which include metal gate electrodes and high-mobility channel materials, will also be discussed. The IWDTF will provide a great opportunity for inf
  4 KB (642 words) - 23:21, 14 October 2008
• SISC 2008
  ...ce that provides a forum for device engineers, solid state physicists, and materials scientists to discuss topics of common interest both formally through invit ...SC is sponsored by the IEEE Electron Device Society and is endorsed by the Materials Research Society.
  3 KB (473 words) - 23:21, 14 October 2008
• MNC 2008
  1-3:Resist Materials and Processing
  1 KB (144 words) - 23:21, 14 October 2008
• IVESC 2008
  | Homepage = www.materials.qmul.ac.uk/conferences/ivesc2008/submit
  566 bytes (63 words) - 23:21, 14 October 2008
• ISDN 2008
  | Title = International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability, and Manufacturing
  633 bytes (68 words) - 23:22, 14 October 2008
• IITC 2008
  ...um for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exc Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference on June 4 and 5. Supplier seminars will
  6 KB (798 words) - 23:22, 14 October 2008
• C3IT 2009
  9. Photonic Devices 29. Physics, Materials & CAD
  3 KB (357 words) - 23:23, 14 October 2008
• BTW 2008
  ...the accepted contributions whose authors wish to provide the corresponding materials on the BTW web site.
  3 KB (407 words) - 23:23, 14 October 2008
• MNRC 2008
  * Nanoelectronics Materials and Devices
  2 KB (228 words) - 23:24, 14 October 2008
• IPTA 2008
  ...rocessing theory and tools, for attending extensive educational high level materials, sharing their achievements, exchanging their experiences and discussing fu
  4 KB (475 words) - 23:25, 14 October 2008
• SoCG 2008
  ...en pages) may be included directly in the submitted file; other supporting materials (such as video or multimedia presentation, source code, experimental data.. Appendices and supporting materials will not be regarded as part of the actual submission and will be considere
  5 KB (727 words) - 23:27, 14 October 2008
• NIF 2008
  Leveraging Nanotech-Enabled Applications and Advanced Materials for Business and Investment Opportunities ...financing the global economy's nanotech-enabled applications and advanced materials.
  4 KB (456 words) - 23:28, 14 October 2008
• ICMA 2009
  - opto-electronic elements and Materials, laser technology and laser processing
  3 KB (482 words) - 23:29, 14 October 2008
• MEMS 2009
  * Silicon and non-silicon materials
  2 KB (278 words) - 22:54, 4 February 2009
• CANEUS 2008
  * Exciting early research results in MNT materials, devices, and systems. Structures and Materials
  8 KB (999 words) - 23:30, 14 October 2008
• NMDC 2008
  | Title = 2nd Nanotechnology Materials and Devices Conference
  525 bytes (57 words) - 23:30, 14 October 2008
• NT 2008
  Nanotubes belong to a class of materials which owing to their quasi one-dimensional structure exhibit a variety of f * Mechanical properties of nanotubes and composite materials
  2 KB (290 words) - 23:30, 14 October 2008
• ANM 2008
  | Title = 2nd International Conference on Advanced Nano Materials The aim of the 2nd International Conference on Advanced Nano Materials (ANM 2008) is to bring together eminent researchers from both academia and
  2 KB (209 words) - 17:00, 27 December 2015
• NANA 2008
  ...ameliorating the cost, durability, and weight of extant aircraft building materials. No less important, nanotechnology could one day solve the world's energy p
  4 KB (548 words) - 23:30, 14 October 2008
• NANO - RIO 2008
  | Title = 9th International Conference on Nanostructured Materials
  558 bytes (64 words) - 23:30, 14 October 2008
• SmartMat 2008
  | Title = Smart/Intelligent Materials and Nano Technology ...industrialists interested in the recent developments in smart/intelligent materials.
  4 KB (448 words) - 23:30, 14 October 2008
• NanoSPD 2008
  ...in basic aspects and applications of ultrafine grained and nanostructured materials. ..., 2008. All papers presented at NanoSPD4 will appear in a special issue of Materials Science Forum, published by Trans Tech Publications in Switzerland (http://
  3 KB (381 words) - 23:30, 14 October 2008
• Solar 2008
  ...esting Systems, Supramolecular Nanomaterials and Lithography, Polymers and Materials, etc. Physical properties of thin films of molecular organic materials
  6 KB (742 words) - 23:30, 14 October 2008
• MPA 2008
  | Title = 2nd International Meeting on Developments in Materials, Processes and Applications of Nanotechnology
  681 bytes (78 words) - 23:30, 14 October 2008
• Nano Energy 2008
  Today, nano-materials are the foundation for a fast-growing approach to energy saving. Indeed, na ...t of automobiles by the use of carbon nanotube and nanofibers in composite materials for weight reduction in automotive applications.
  3 KB (367 words) - 06:10, 12 April 2010
• CIMTEC 2008
  | Title = The 3rd International Conference on Smart Materials, Structures and Systems The 3rd International Conference "Smart Materials, Structures and Systems" will be held in Acireale (Catania District), Sicil
  2 KB (339 words) - 23:30, 14 October 2008
• APBC 2009
  Authors can provide supplementary materials at their own website
  10 KB (1,209 words) - 17:05, 27 December 2015
• ICC 2020
  Centers for Disease Control’s reference materials
  3 KB (442 words) - 09:29, 4 August 2023
• WALMI 2008
  | Title = SEMINAR ON APPLICATION OF LASER IN MATERIALS PROCESSING
  500 bytes (56 words) - 23:34, 14 October 2008
• SCMC 2008
  | Title = Solid State and Materials Chemistry
  509 bytes (57 words) - 23:35, 14 October 2008
• MobiSec 2009
  1) title and outline of materials to be presented,
  4 KB (451 words) - 23:37, 14 October 2008
• TERA 2008
  * Novel materials for THz applications
  2 KB (270 words) - 23:37, 14 October 2008
• MWP 2008
  * Advances in materials for analog fiber links
  2 KB (237 words) - 23:38, 14 October 2008
• FEM 2008
  * FEM Applications: Antennas, Materials and Meta-materials, Bio-electromagnetics, Electromagnetic Compatibility, Circuits and Circuit
  2 KB (190 words) - 23:39, 14 October 2008
• OSDI 2008
  Registration Materials
  8 KB (1,171 words) - 13:44, 16 November 2016
• Structural Dynamics & Mat. 2009
  | Title = 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference (SDM) 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
  4 KB (540 words) - 23:39, 14 October 2008
• RadarConf 2009
  ...of-the-art signal processing components, materials (including chiral, meta-materials, and others), manufacturing techniques and packaging, distributed processin
  5 KB (625 words) - 20:19, 23 June 2020
• MEFL 2008
  ...e cover the participation in the conference, a hard copy of the Conference materials (collection of the conference reports and thesis, some additional info pack
  5 KB (668 words) - 11:41, 29 September 2016
• SE@M 2008
  | Title = Second International Workshop on Search and Exchange of e-le@rning Materials Second International Workshop on Search and Exchange of e-le@rning Materials (SE@M'08)
  6 KB (821 words) - 23:41, 14 October 2008
• ISAPE 2008
  E2. Absorbing Materials F14. New Materials
  4 KB (564 words) - 23:41, 14 October 2008
• ECTC 2009
  substrates;electronic components-design,materials,processing,test,characterization; nano materials and processes;tunable materials,structures,devices and switches;
  7 KB (1,023 words) - 23:41, 14 October 2008
• SSMC 2008
  | Title = Solid State and Materials Chemistry
  507 bytes (57 words) - 23:42, 14 October 2008
• IPCC 2008
  ...on and the exchange of data and ideas. We all either contribute to or use materials from the information economy in most aspects of our everyday lives. As a r
  3 KB (483 words) - 15:10, 18 May 2011
• Codingdays 2008
  Conference registration fee is �? 250 and includes: conference materials, CD-ROM proceedings, welcome reception, coffee breaks, banquet.
  2 KB (245 words) - 23:43, 14 October 2008
• ZAFIN 2009
  ...1 150 PLN (1USD is about 2.8 PLN) - covers costs of publishing, conference materials, full board and accommodation and accompanying events ...e - 700 PLN - covers only costs of publishing and paper copy of conference materials.
  3 KB (362 words) - 22:22, 11 December 2008
• ZAFIN
  ...1 150 PLN (1USD is about 2.8 PLN) - covers costs of publishing, conference materials, full board and accommodation and accompanying events ...e - 700 PLN - covers only costs of publishing and paper copy of conference materials.
  2 KB (245 words) - 22:25, 11 December 2008
• PALC 2009
  * Language Teaching Materials and Language (Learner) Corpora/ICT
  3 KB (386 words) - 12:57, 18 January 2009
• ECMS 2009
  ...universities: Automatic Control, Robotics, Electrical Drives, Intelligent Materials and Devices, Modelling and Simulations of Processes, Dependability, Signal * Intelligent Materials and Devices: Sensors, Actuators, Transducers, Resonators, MEMS, Characteriz
  3 KB (355 words) - 13:03, 18 January 2009
• ENTIDENTIC 2012
  Please send your materials and address your enquiries to Ms. Silvia Stoica (President of Ars Identitat
  6 KB (881 words) - 17:08, 31 January 2012
• NAECON 2009
  Innovative Aerospace Materials,
  2 KB (232 words) - 22:10, 27 February 2009
• AIIDE 2009
  ...by email or FTP up-load. Demonstration authors should submit abstracts and materials by April 14, 2009. Submissions will be judged on technical merit, accessibi
  8 KB (1,134 words) - 17:06, 27 February 2009
• IEEE CEC 2009
  ...Abstract (1-2 paragraphs suitable for inclusion in conference registration materials)
  4 KB (528 words) - 17:06, 27 February 2009
• TKDE 2009
  Publication materials due: December 4, 2009
  7 KB (883 words) - 17:06, 27 February 2009
• IJSC 2009
  Publication materials due
  3 KB (440 words) - 17:06, 27 February 2009
• ICIQ 2009
  ...re anonymous. Authors should avoid identifying themselves in the submitted materials. For further information, such as program committee, reviewer guidelines, d
  5 KB (690 words) - 17:07, 27 February 2009
• TLOE 2009
  ...l benefit from information on the preparation and presentation of learning materials for online transformative learning that will be presented in this book. Mor
  5 KB (647 words) - 17:07, 27 February 2009
• ISC 2009
  ...ystems, distribution centres, inventory management, warehousing decisions, materials management, handling and packaging, logistics information systems, informat ...future space transport architectures, Rocket propulsion simulation, Space materials and structures, Aerothermodynamics, launcher health management systems, avi
  38 KB (4,832 words) - 17:07, 27 February 2009
• TAROS 2009
  * Advanced materials
  1 KB (165 words) - 21:07, 27 February 2009
• META 2010
  ...onics. Special attention will be given to applications of these innovative materials in optical communication systems, antennas, high-speed circuits, optical se complex materials.
  2 KB (206 words) - 20:54, 27 February 2009
• CoNLL 2020
  materials are allowed as an optional PDF appendix, in line with
  3 KB (349 words) - 11:44, 3 August 2020
• ESWC 2021
  *We strongly encourage and appreciate links to datasets and other materials used for evaluation as well as to demos and software source code.
  5 KB (607 words) - 19:34, 22 March 2021
• ICCEE 2009
  Materials for Electrotechnics
  3 KB (412 words) - 19:29, 2 August 2009
• EDUCON 2010
  * Area 2: Innovative Materials, Teaching and Learning Experiences in Engineering Education
  4 KB (499 words) - 14:57, 27 December 2015
• JBET 2009
  ...e molecular to the organ systems level; and develops innovative biologics, materials, processes, implants, devices and informatics approaches for the prevention ...nical, transport and biocompatibility properties of implantable artificial materials)
  3 KB (395 words) - 15:56, 15 February 2017
• AEMC 2009
  Electromagnetic Materials (EMM) Microwave Devices and Circuits (MDC)
  3 KB (381 words) - 12:56, 27 December 2015
• VLSI-TSA 2010
  * High-k and low-k materials
  3 KB (375 words) - 11:34, 2 August 2009
• DIS 2010
  ...ogy: Mobile devises - Sensors - Huge and tiny displays - Actuators - Smart materials. The design process: Tools and techniques - Materials and representations - Innovation - Reflection on design processes - Managem
  2 KB (275 words) - 11:35, 2 August 2009
• POWER MEMS 2009
  * Thermoelectric and photovoltaic materials and systems * Nanostructured materials for energy and thermal management
  2 KB (211 words) - 11:35, 2 August 2009
• IHTC 2010
  ...C is expected to address the emerging domains of thermal transport in nano-materials, bio-systems, power generation, microsystems, energy conversion devices, ae
  3 KB (423 words) - 11:35, 2 August 2009
• IJECEE 2009
  ...ng educators in the areas of education methods and technology, instruction materials, educational and professional development programs, as well as assessment i
  3 KB (457 words) - 15:55, 15 February 2017
• LRL 2009
  - Conference materials.
  14 KB (1,872 words) - 19:26, 2 August 2009
• CHST 2009
  ⑵. Research on Greenhouses Wall Materials
  2 KB (249 words) - 11:36, 2 August 2009
• International Journal of Computer Science Issues
  ...tance in development of science, fast operative publication and storage of materials and results of scientific researches and representation of the scientific c
  1 KB (164 words) - 11:17, 12 November 2019
• Metamaterials'2010
  |Title=Fourth International Congress on Advanced Electromagnetic Materials |Series=Congress on Advanced Electromagnetic Materials
  4 KB (405 words) - 16:50, 1 October 2009
• ISABEL 2010
  ...s in communication technologies – from algorithms to the electronics and materials – are “bio-inspired”. Moreover, it is increasing the awareness of the '''Track 2: Devices, Materials and Electronics:'''
  6 KB (758 words) - 18:02, 6 January 2010
• Dr. Emily Jonathan
  * [[Convergence Components & Materials Research ]] ...industries beyond the memory industry. Moreover, Convergence Components & Materials Laboratory will develop the high value-added convergence components technol
  3 KB (373 words) - 13:50, 19 January 2010
• BIODEVICES 2011
  ...nical engineering, interested in studying and using models, equipments and materials inspired from biological systems and/or addressing biological requirements.
  2 KB (210 words) - 14:13, 10 March 2010
• ECONAM
  |Title='''ECONAM - Electromagnetic Characterization of Nanostructured Materials''' ...of novel techniques for electromagnetic characterization of nanostructured materials and preparation of standards in the field of nanomaterials characterisation
  2 KB (244 words) - 19:56, 17 March 2010
• ICAPS 2019
  Workshop Call for Papers and materials for the website: December 28, 2018.<br>
  3 KB (397 words) - 13:21, 27 February 2020
• ICRET 2019
  *New Energy Materials and Devicesyy
  4 KB (576 words) - 08:22, 24 July 2019
• ICRET 2020
  *New Energy Materials and Devices
  6 KB (812 words) - 09:23, 24 July 2019
• CALL FOR PAPER Journal: International Journal of Engineering (IJE)
  • Manufacturing Engineering • Materials & Technology Engineering
  3 KB (322 words) - 16:47, 5 July 2020
• CALL FOR PAPER Journal: International Journal of Image Processing (IJIP)
  • Chemistry of photosensitive materials • Coating technologies • Materials for electro-photography • Network architecture for real-time video transp
  3 KB (395 words) - 16:47, 5 July 2020
• 2019 3rd International Conference on Composite Material, Polymer Science and Engineering
  ...All accepted and registered papers will be published in “Key Engineering Materials” [ISSN print 1013-9826 ISSN cd 1662-9809 ISSN web 1662-9795]. And then wi T1: Composite materials<br>
  2 KB (206 words) - 11:55, 15 August 2019
• SYSINT 2020
  ...ence. The focus is on integration of new, intelligent functionalities into materials, components, systems and products to enable future technologies with enhanc
  2 KB (207 words) - 15:36, 30 August 2019
• MESA 2011
  * New Materials, New Sensing and Actuation Technology for Biomechatronic
  12 KB (1,378 words) - 21:13, 28 November 2010
• IJCSI Journal Publications 2011
  ...e in the development of science, fast operative publication and storage of materials and results of scientific researches and representation of the scientific c
  2 KB (220 words) - 08:26, 10 December 2010
• UeL 2011
  ...e the advent of smart phones and e-books. Virtual laboratories, e-Learning materials, and even colleagues and tutors can now be accessed from anywhere at any ti
  3 KB (364 words) - 17:56, 7 January 2011
• CIPIC 2011
  Please send your materials and adress your enquiries to Ms. Silvia Stoica (Director, Ars Identitatis),
  3 KB (443 words) - 03:49, 25 January 2011
• LTE 2011
  The conference fee is 200 zlotys (PLN). This will include conference materials, proceedings volume publication, coffee break(s) and dinner. The account nu
  2 KB (257 words) - 01:52, 19 February 2011
• ISABEL 2011
  algorithms to the electronics and materials – are “bio-inspired”. Moreover, Track 2: Devices, Materials and Electronics
  6 KB (776 words) - 18:20, 4 March 2011
• BIODEVICES 2012
  ...nical engineering, interested in studying and using models, equipments and materials inspired from biological systems and/or addressing biological requirements.
  2 KB (231 words) - 17:09, 6 April 2011

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