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• M3 2011
  |Title=Annual International Conference on Materials Science, Metal and Manufacturing Annual International Conference on Materials Science, Metal and Manufacturing (M3 2011)
  4 KB (424 words) - 10:39, 24 June 2011
• NSPW 2008
  ...the topic will lead to a lively discussion, and other optional supporting materials such as the credentials of the proposed panelists.
  8 KB (1,072 words) - 23:20, 14 October 2008
• META 2008
  ...ction of a diverse spectrum of electrical, microwave, infrared and optical materials and devices. ...nents. Special attention will be given to applications of these innovative materials in secure wireless and optical communication systems, antennas, high-speed
  2 KB (276 words) - 23:20, 14 October 2008
• DSS 2008
  ...engineers from industry, military, and academia doing cutting-edge work in materials, technology, systems and devices.
  1 KB (167 words) - 23:20, 14 October 2008
• SysML 2008
  Registration Materials
  6 KB (837 words) - 23:21, 14 October 2008
• ULIS 2009
  ...electronics: strained Si, strained SOI, SiGe, GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devi * Thin gate dielectrics: first and second generation high-k materials for switches and memory.
  4 KB (507 words) - 23:21, 14 October 2008
• IWCE 2009
  nano-materials, optoelectronic and organic devices and sensors are also included. The lation �?� Simulation of materials and material interfaces.
  3 KB (385 words) - 23:21, 14 October 2008
• ASMC 2009
  * Advanced Processes and Materials Walter Schoenleber, Applied Materials
  4 KB (554 words) - 23:21, 14 October 2008
• IWDTF 2008
  ...gate stacks, which include metal gate electrodes and high-mobility channel materials, will also be discussed. The IWDTF will provide a great opportunity for inf
  4 KB (642 words) - 23:21, 14 October 2008
• SISC 2008
  ...ce that provides a forum for device engineers, solid state physicists, and materials scientists to discuss topics of common interest both formally through invit ...SC is sponsored by the IEEE Electron Device Society and is endorsed by the Materials Research Society.
  3 KB (473 words) - 23:21, 14 October 2008
• MNC 2008
  1-3:Resist Materials and Processing
  1 KB (144 words) - 23:21, 14 October 2008
• IVESC 2008
  | Homepage = www.materials.qmul.ac.uk/conferences/ivesc2008/submit
  566 bytes (63 words) - 23:21, 14 October 2008
• ISDN 2008
  | Title = International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability, and Manufacturing
  633 bytes (68 words) - 23:22, 14 October 2008
• IITC 2008
  ...um for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exc Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference on June 4 and 5. Supplier seminars will
  6 KB (798 words) - 23:22, 14 October 2008
• C3IT 2009
  9. Photonic Devices 29. Physics, Materials & CAD
  3 KB (357 words) - 23:23, 14 October 2008
• BTW 2008
  ...the accepted contributions whose authors wish to provide the corresponding materials on the BTW web site.
  3 KB (407 words) - 23:23, 14 October 2008
• MNRC 2008
  * Nanoelectronics Materials and Devices
  2 KB (228 words) - 23:24, 14 October 2008
• IPTA 2008
  ...rocessing theory and tools, for attending extensive educational high level materials, sharing their achievements, exchanging their experiences and discussing fu
  4 KB (475 words) - 23:25, 14 October 2008
• SoCG 2008
  ...en pages) may be included directly in the submitted file; other supporting materials (such as video or multimedia presentation, source code, experimental data.. Appendices and supporting materials will not be regarded as part of the actual submission and will be considere
  5 KB (727 words) - 23:27, 14 October 2008
• NIF 2008
  Leveraging Nanotech-Enabled Applications and Advanced Materials for Business and Investment Opportunities ...financing the global economy's nanotech-enabled applications and advanced materials.
  4 KB (456 words) - 23:28, 14 October 2008

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