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- |Title=Annual International Conference on Materials Science, Metal and Manufacturing Annual International Conference on Materials Science, Metal and Manufacturing (M3 2011)4 KB (424 words) - 10:39, 24 June 2011
- ...the topic will lead to a lively discussion, and other optional supporting materials such as the credentials of the proposed panelists.8 KB (1,072 words) - 23:20, 14 October 2008
- ...ction of a diverse spectrum of electrical, microwave, infrared and optical materials and devices. ...nents. Special attention will be given to applications of these innovative materials in secure wireless and optical communication systems, antennas, high-speed2 KB (276 words) - 23:20, 14 October 2008
- ...engineers from industry, military, and academia doing cutting-edge work in materials, technology, systems and devices.1 KB (167 words) - 23:20, 14 October 2008
- Registration Materials6 KB (837 words) - 23:21, 14 October 2008
- ...electronics: strained Si, strained SOI, SiGe, GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devi * Thin gate dielectrics: first and second generation high-k materials for switches and memory.4 KB (507 words) - 23:21, 14 October 2008
- nano-materials, optoelectronic and organic devices and sensors are also included. The lation �?� Simulation of materials and material interfaces.3 KB (385 words) - 23:21, 14 October 2008
- * Advanced Processes and Materials Walter Schoenleber, Applied Materials4 KB (554 words) - 23:21, 14 October 2008
- ...gate stacks, which include metal gate electrodes and high-mobility channel materials, will also be discussed. The IWDTF will provide a great opportunity for inf4 KB (642 words) - 23:21, 14 October 2008
- ...ce that provides a forum for device engineers, solid state physicists, and materials scientists to discuss topics of common interest both formally through invit ...SC is sponsored by the IEEE Electron Device Society and is endorsed by the Materials Research Society.3 KB (473 words) - 23:21, 14 October 2008
- 1-3:Resist Materials and Processing1 KB (144 words) - 23:21, 14 October 2008
- | Homepage = www.materials.qmul.ac.uk/conferences/ivesc2008/submit566 bytes (63 words) - 23:21, 14 October 2008
- | Title = International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability, and Manufacturing633 bytes (68 words) - 23:22, 14 October 2008
- ...um for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exc Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference on June 4 and 5. Supplier seminars will6 KB (798 words) - 23:22, 14 October 2008
- 9. Photonic Devices 29. Physics, Materials & CAD3 KB (357 words) - 23:23, 14 October 2008
- ...the accepted contributions whose authors wish to provide the corresponding materials on the BTW web site.3 KB (407 words) - 23:23, 14 October 2008
- * Nanoelectronics Materials and Devices2 KB (228 words) - 23:24, 14 October 2008
- ...rocessing theory and tools, for attending extensive educational high level materials, sharing their achievements, exchanging their experiences and discussing fu4 KB (475 words) - 23:25, 14 October 2008
- ...en pages) may be included directly in the submitted file; other supporting materials (such as video or multimedia presentation, source code, experimental data.. Appendices and supporting materials will not be regarded as part of the actual submission and will be considere5 KB (727 words) - 23:27, 14 October 2008
- Leveraging Nanotech-Enabled Applications and Advanced Materials for Business and Investment Opportunities ...financing the global economy's nanotech-enabled applications and advanced materials.4 KB (456 words) - 23:28, 14 October 2008