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  • of advanced packaging and novel component integration technologies involving elec- electromigration,conductive polymers and nano material based interconnects,novel
    7 KB (1,023 words) - 23:41, 14 October 2008
  • |Field=industrial diamond, cubic boron nitride, manufacture component material, machining and grinding
    536 bytes (63 words) - 11:16, 5 September 2016