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• MWP 2008
  * Advances in materials for analog fiber links
  2 KB (237 words) - 23:38, 14 October 2008
• FEM 2008
  * FEM Applications: Antennas, Materials and Meta-materials, Bio-electromagnetics, Electromagnetic Compatibility, Circuits and Circuit
  2 KB (190 words) - 23:39, 14 October 2008
• OSDI 2008
  Registration Materials
  8 KB (1,171 words) - 13:44, 16 November 2016
• Structural Dynamics & Mat. 2009
  | Title = 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference (SDM) 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
  4 KB (540 words) - 23:39, 14 October 2008
• RadarConf 2009
  ...of-the-art signal processing components, materials (including chiral, meta-materials, and others), manufacturing techniques and packaging, distributed processin
  5 KB (625 words) - 20:19, 23 June 2020
• MEFL 2008
  ...e cover the participation in the conference, a hard copy of the Conference materials (collection of the conference reports and thesis, some additional info pack
  5 KB (668 words) - 11:41, 29 September 2016
• SE@M 2008
  | Title = Second International Workshop on Search and Exchange of e-le@rning Materials Second International Workshop on Search and Exchange of e-le@rning Materials (SE@M'08)
  6 KB (821 words) - 23:41, 14 October 2008
• ISAPE 2008
  E2. Absorbing Materials F14. New Materials
  4 KB (564 words) - 23:41, 14 October 2008
• ECTC 2009
  substrates;electronic components-design,materials,processing,test,characterization; nano materials and processes;tunable materials,structures,devices and switches;
  7 KB (1,023 words) - 23:41, 14 October 2008
• SSMC 2008
  | Title = Solid State and Materials Chemistry
  507 bytes (57 words) - 23:42, 14 October 2008
• IPCC 2008
  ...on and the exchange of data and ideas. We all either contribute to or use materials from the information economy in most aspects of our everyday lives. As a r
  3 KB (483 words) - 15:10, 18 May 2011
• Codingdays 2008
  Conference registration fee is �? 250 and includes: conference materials, CD-ROM proceedings, welcome reception, coffee breaks, banquet.
  2 KB (245 words) - 23:43, 14 October 2008
• ZAFIN 2009
  ...1 150 PLN (1USD is about 2.8 PLN) - covers costs of publishing, conference materials, full board and accommodation and accompanying events ...e - 700 PLN - covers only costs of publishing and paper copy of conference materials.
  3 KB (362 words) - 22:22, 11 December 2008
• ZAFIN
  ...1 150 PLN (1USD is about 2.8 PLN) - covers costs of publishing, conference materials, full board and accommodation and accompanying events ...e - 700 PLN - covers only costs of publishing and paper copy of conference materials.
  2 KB (245 words) - 22:25, 11 December 2008
• PALC 2009
  * Language Teaching Materials and Language (Learner) Corpora/ICT
  3 KB (386 words) - 12:57, 18 January 2009
• ECMS 2009
  ...universities: Automatic Control, Robotics, Electrical Drives, Intelligent Materials and Devices, Modelling and Simulations of Processes, Dependability, Signal * Intelligent Materials and Devices: Sensors, Actuators, Transducers, Resonators, MEMS, Characteriz
  3 KB (355 words) - 13:03, 18 January 2009
• ENTIDENTIC 2012
  Please send your materials and address your enquiries to Ms. Silvia Stoica (President of Ars Identitat
  6 KB (881 words) - 17:08, 31 January 2012
• NAECON 2009
  Innovative Aerospace Materials,
  2 KB (232 words) - 22:10, 27 February 2009
• AIIDE 2009
  ...by email or FTP up-load. Demonstration authors should submit abstracts and materials by April 14, 2009. Submissions will be judged on technical merit, accessibi
  8 KB (1,134 words) - 17:06, 27 February 2009
• IEEE CEC 2009
  ...Abstract (1-2 paragraphs suitable for inclusion in conference registration materials)
  4 KB (528 words) - 17:06, 27 February 2009

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