View source for SMMP2023

{{Event
|Acronym=SMMP2023
|Title=2023 2nd International Conference on Smart Manufacturing and Material Processing
|Ordinal=2
|Type=Conference
|Field=Smart Manufacturing Technology, Manufacturing Processes and Systems, Materials Processing Engineering
|Start date=2023/08/25
|End date=2023/08/27
|Homepage=http://www.icsmmp.org/
|City=Wuhan
|State=Hubei Province
|Country=China
}}
The 2nd International Conference on Smart Manufacturing and Material Processing (SMMP2023) invites the submission of original research papers in the fields of material sciences and smart manufacturing to be published in the conference proceedings. 

The response to our Call for Papers this year was great and we received proposals from all over the world. Now SMMP2023 has decided to extend the submission deadline.

AND EVEN BETTER is that selected excellent papers will enjoy an excellent discount.

==Topics==
1. Smart Manufacturing Technology
Intelligent control system
Computer integrated manufacturing system
Advanced control and Optimization Technology
Applications of AI Techniques in Design and Manufacturing
New Sensing Technology
Precision ultra-precision machining technology
Laser processing technology
Intelligent Manufacturing Technology
Additive Manufacturing and materials processing Technology
Advanced Manufacturing Production Mode
Virtual Manufacturing and Network Manufacturing
System Analysis and Industrial Engineering
Microelectronics packaging, testing and manufacturing technology
Industrial robots and automatic production line
 
2. Manufacturing Processes and Systems
Material processing and forming
Surface Engineering/Coating
Tribology in Manufacturing Processes
Quality Monitoring and Control of the Manufacturing Process
E-manufacturing, ERP, and Integrated Factory
Operations, and Production Management
Machinery control and information processing technology
Precision Engineering, and Concurrent Engineering
Engineering Optimization
 
3. Materials Processing Engineering
Polymer Materials
Metamaterial structure design
Structural strength, fatigue and stability
Polymer Processing
Super Alloys
Advanced metal forming, bending, welding & casting techniques
Fabrication Process of Nano materials and Nano devices
Advanced machining processes
Recycling and re-manufacturing of Materials and Components
Microwave Processing of Materials
Thermal Engineering Theory and Applications
Thermally-Enhanced Processes and Materials
Material calculation and numerical simulation

==Submissions==
All submissions must be in English with a varying length from 4 to 10 pages including figures and references, adhere to the template format in the conference website, and must be submitted to conference email address: contact@icsmmp.org.

==Important Dates==
Last date for paper submission: June 30, 2023  July 31, 2023
Last date for paper acceptance: July 31, 2023  August 15, 2023
Last date for registration: August 15, 2023  August 25, 2023
If you have to make an overdue submission, email the conference secretary at contact@icsmmp.org

==Committees==
* Co-Organizers
International Association of Applied Science and Technology (IAAST)
Wuhan Institute of Technology
Nanotechnology and Multifunctional Structures Research Center (NMSRC)

* General Co-Chairs
Babak Safaei, Associate Professor, Department of Mechanical Engineering, Eastern Mediterranean University, Turkey.
Jinfeng Wang, Professor, School of Management Engineering, Zhengzhou University, China.

* Technical Committee members
Aleksandar Rikalović, University of Novi Sad, Serbia
Adil Tamimi, University of Strathclyde, Scotland
Afshin Abrishamkar, McMaster University, Canada
Arkadiusz Gola, Lublin University of Technology, Poland
Bruce Jo, ADAMS Laboratory, USA
Chenwei Shao, Chinese Academy of Sciences, China
David Bassir, Universitéde Technologies de Belfort-Montbéliard, France
Dawei Jiang, Northeast Forestry University, China
Edgar Alfonso Chacón Ramírez, Universidad de los Andes, Venezuela
Eng. Rositsa Petkova-Slipets, VFU "Chernorizets Hrabar", Bulgaria
Himansu Sekhar Nanda, PDPM-Indian Institute of Information Technology, Design & Manufacturing Jabalpur, India
Izabela Major, Czestochowa University of Technology, Poland
Jieshan Qiu, Dalian University of Technology, China
Jai Prakash,  National Institute of Technology (NIT) Hamirpur , India
Jinlian HU, City University of Hong Kong, China
Jun Lei，Beijing University of Technology，China
Junwei Zha, University of Science and Technology Beijing, China
Kamila Kotrasová, Technical University of Košice, Slovak Republic
Martina Zelenakova, Technical University of Kosice, Slovakia
Martin Krejsa, Technical University of Ostrava, Republic Czechia
Mehmet AVCAR, Süleyman Demirel University, Turkey
Mohammed Bsher A. Asmael, Eastern Mediterranean University, Cyprus
Peng Zhao, Zhejiang University, China
Quanle Zou, Chongqing University, China
Rekha Raja,  University of California Davis (UCD), California, USA
Sadettin Cem Altıparmak‬, Imperial College London, UK
Samuel Abejide, Walter Sisulu University, South Africa
Suriani Mat Jusoh, Universiti Malaysia Terengganu, Malaysia
Tokeer Ahmad, Jamia Millia Islamia, India
Tien-Chien Jen, University of Johannesburg; South Africa
Voon Loong Wong, Heriot-Watt University,  Malaysia
Wenlong Li, Huazhong University of Science and Technology, China
Xiaoxiao Meng, Harbin Institute of Technology, China
Yupiter HP Manurung, UiTM Shah Alam, Malaysia
Acronym	SMMP2023 +
End date	August 27, 2023 +
Event type	Conference +
Has location city	Wuhan +
Has location country	Category:China +
Has location state	Hubei Province +
Homepage	http://www.icsmmp.org/ +
IsA	Event +
Ordinal	2 +
Start date	August 25, 2023 +
Title	2023 2nd International Conference on Smart Manufacturing and Material Processing +